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Shunt Chip Resistors

ISA-WELD SHUNT CHIP RESISTORS @
@  
Stock @ Back
Standard DeliveryFBVS 60 days / BVE,BVT 90 days




BVT
Type
Load Capacity(W)–
Resistance (ƒΆ)
Tolerance(%)
Temp.Coefficien
(20Ž`60Ž)
Internal Thermal Resistance(Ž/W)
BVT-Z-R0003
3
0.3m
±1
}175ppm/Ž
4Ž/W
BVT-M-R0005
3
0.5m
}115ppm/Ž
7Ž/W
BVT-M-R001
3
1m
}100ppm/Ž
14Ž/W
BVT-I-R002
3
2m
}50ppm/Ž
20Ž/W
BVT-I-R003
2
3m
}50ppm/Ž
30Ž/W
BVT-I-R004
2
4m
}50ppm/Ž
40Ž/W

Specification
OperatingTemp
@-55Ž ` +170Ž
Load Capacity(W)
Free Air
@0.3W
Solder Reflow
@MAX. 255Ž (t<40sec)
Weight
@0.15g

@* Refe‚’‚’ing to power derating curve. Proper measures for heat radiation hould should be taken.



BVS
Type
Load Capacity(W)–
Resistance (ƒΆ)
Tolerance(%)
Temp.Coefficien
(20Ž`60Ž)
Internal Thermal Resistance(Ž/W)
BVS-Z-R0002
5
0.2m
±1
}200ppm/Ž
3Ž/W
BVS-M-R0003
5
0.3m
}150ppm/Ž
4.5Ž/W
BVS-M-R0005
5
0.5m
}70ppm/Ž
8Ž/W
BVS-M-R0007
5
0.7m
}60ppm/Ž
11Ž/W
BVS-M-R001
4
1m
}50ppm/Ž
15Ž/W
BVS-A-R002
4
2m
}50ppm/Ž
16Ž/W
BVS-A-R003
3
3m
}50ppm/Ž
22Ž/W
BVS-A-R004
2.5
4m
}50ppm/Ž
30Ž/W
BVS-I-R002
4
2m
}50ppm/Ž
16Ž/W
BVS-I-R003
3
3m
}50ppm/Ž
24Ž/W
BVS-I-R004
2.5
4m
}50ppm/Ž
32Ž/W
BVS-‚h-R005
2
5m
}50ppm/Ž
50Ž/W

Specification
OperatingTemp
@-55Ž ` +170Ž
Load Capacity(W)
Free Air
@0.5W
Solder Reflow
@MAX. 255Ž (t<40sec)
Weight
@0.2g


@* Refe‚’‚’ing to power derating curve. Proper measures for heat radiation hould should be taken.



BVE
Type
Load Capacity(W)–
Resistance (ƒΆ)
Tolerance(%)
Temp.Coefficien
(20Ž`60Ž)
Internal Thermal Resistance(Ž/W)
BVE-M-R0002
10
0.2m
±1 ±100ppm/Ž
3Ž/W
BVE-M-R0003
7
0.3m
±100ppm/Ž
4.5Ž/W
BVE-M-R0005
6
0.5m
±75ppm/Ž
8Ž/W
BVE-A-R0005
7
0.5m
±75ppm/Ž
5Ž/W
BVE-A-R001
6
1m
±50ppm/Ž
8Ž/W

Specification
OperatingTemp
@-55Ž ` +170Ž
Load Capacity(W)
Free Air
@1W
Solder Reflow
@MAX. 255Ž (t<40sec)
Weight
@1.2g

@* Refe‚’‚’ing to power derating curve. Proper measures for heat radiation hould should be taken.




 
ISA-WELD SHUNT CHIP RESISTORS @
@  
@
Standard Delivery : BVR 60 days / BVB 90 days

BVRBVB




BVR
Type
Load Capacity(W)–
Resistance (ƒΆ)
Tolerance(%)
Temp.Coefficien
(20Ž`60Ž)
Internal Thermal Resistance(Ž/W)
BVR-Z-R0002
5
0.2m
}1@}5
}50ppm/Ž
4Ž/W
BVR-Z-R0003
5
0.3m
5Ž/W
BVR-Z-R0005
5
0.5m
8Ž/W
BVR-M-R0007
4
0.7m
12Ž/W
BVR-M-R001
4
1m
14Ž/W
BVR-I-R002
4
2m
14Ž/W
BVR-I-R003
3
3m
21Ž/W

Specification
OperatingTemp
@-55Ž ` +170Ž
Load Capacity(W)
Free Air
@0.5W
Solder Reflow
@MAX. 255Ž (t<40sec)
Weight
@0.3g

@* Refe‚’‚’ing to power derating curve. Proper measures for heat radiation hould should be taken.


BVB
Type
Load Capacity(W)–
Resistance (ƒΆ)
Tolerance(%)
Temp.Coefficien
(20Ž`60Ž)
Internal Thermal Resistance(Ž/W)
BVB-Z-R0002
5
0.2m
±1@±5
±50ppm/Ž

4Ž/W
BVB-Z-R0005
5
0.5m
8Ž/W
BVB-M-R001
4
1m
15Ž/W
BVB-I-R002
4
2m
14Ž/W
BVB-I-R003
3
3m
21Ž/W
BVB-I-R005
2
5m
33Ž/W

Specification
OperatingTemp
@-55Ž ` +170Ž
Load Capacity(W)
Free Air
@0.5W
Solder Reflow
@MAX. 255Ž (t<40sec)
Weight
@0.35g

@* Refe‚’‚’ing to power derating curve. Proper measures for heat radiation hould should be taken.





@
ISA|PLAN SHUNT CHIP RESISTORS @
SMK,SMP,SMS,SMT
@  
Stock @ Back
Standard DeliveryFSMK,SMP 90 days / SMS,SMT 60 days
Type
Load Capacity(W)*mnFreeAir
Resistance Range(ƒΆ)
Resistance Tolerance(%)
Temp.Coefficient
(20Ž`60Ž)
OperatingTemp
Solder Reflow
Internal Thermal Resistance(Ž/W)
SMK
0.5m0.1n
0.01`0.5
}1
±50ppm/Ž(R†15mΩ)
±100ppm/Ž(Rƒ15mΩ)
-55`+170
MAX. 255Ž (t<40sec)
60Ž/W
SMP
1m0.2n
0.005`1
}1
±50ppm/Ž(R†10mΩ)
±100ppm/Ž(Rƒ10mΩ)
30Ž/W
SMT
3m0.5n
0.004`0.68
±1
13Ž/W
SMS
2m0.5n
0.005`1
}1
±50ppm/Ž(R†10mΩ)
±100ppm/Ž(Rƒ10mΩ)
-55`+170
MAX. 255Ž (t<40sec)
20Ž/W

*Refe‚’‚’ing to power derating curve. Proper measures for heat radiation hould should be taken.






 
ISA|PLAN PRECISION SHUNT CHIP RESISTORS @
VMK,VMP,VMS
@  
  @ Back
Standard DeliveryF90 days
Type
Load Capacity(W)
Resistance Range(ƒΆ)
Resistance Tolerance(%)
Temp.Coefficient
(20Ž`60Ž)
OperatingTemp
Solder Reflow
Internal Thermal Resistance(Ž/W)
VMK
1
0.01`0.47
}1
}20ppm/Ž
-55`+170
MAX. 255Ž (t<40sec)
60Ž/W
VMP
2
0.005`1
30Ž/W
VMS
3
0.005`1
25Ž/W

*Refe‚’‚’ing to power derating curve. Proper measures for heat radiation hould should be taken.


 
 


PCN Corporation